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AE/LZB 119 1892 R1A DESCRIPTION

ENHANCED AUDIO ENCLOSURE

The C3 Maestro console’s Enhanced Audio Enclosure

contains all audio interface, audio routing and dispatch

keyboard interface circuitry for the console system.

Basically, the unit consists of:

•

a metal case assembly

•

an ac-to-dc switching power supply located inside

the case assembly

•

an I/O Backplane Board located inside the case

assembly

•

an Audio System Board located inside the case

assembly

•

operating firmware which is part of the Audio

System Board

•

19-inch EIA rack-mount hardware (optional)

Typically, as shown in the photo on the front cover of

this manual, the Enhanced Audio Enclosure is placed on the

console furniture’s desk-top and the video display monitor is

set on top of it. However, it may be rack mounted in a

standard 19-inch cabinet or case; an optional rack-mount kit

is available. When rack mounted, the Enhanced Audio

Enclosure occupies two (2) vertical rack units

(3.5 inches/8.89 cm).

Case Assembly

The Enhanced Audio Enclosure's case assembly

provides housing for all major components within the unit.

As shown in the exploded-view assembly diagram in this

manual (page 27) the case assembly basically consists of a

lower steel frame assembly which includes the rear panel, a

upper steel frame (top cover), a molded plastic front panel

and miscellaneous assembly hardware. The case is

constructed with heavy-gauge sheet metal so heavy items

such as the console's video display monitor can be placed on

its top without causing case distortion.

Assemblies inside the case include the I/O Backplane

Board mounted on the rear panel, the power supply unit

mounted to the bottom of the case, and the Audio System

Board. With the top cover removed, the Audio System

Board slides into and out of the case between two (2) plastic

printed circuit board guides attached to the left and right

inner sides of the case. When fully-inserted, rectangular

96-pin DIN-type connectors on the Audio System Board

mate with 96-pin DIN connectors on the I/O Backplane

Board.

All cable interconnections to and from external

equipment are made via connectors at the Enhanced Audio

Enclosure's rear panel. Openings in the rear panel expose the

I/O Backplane Board's connectors so they may be mated

with connectors on the cables to and from external

equipment. For example, the desk mic's cable is equipped

with a male DB-9 connector which mates with a female

DB-9 connector labeled "DESK MIC" at the Enhanced

Audio Enclosure's rear panel. This female DB-9 connector is

J5 on the I/O Backplane Board.

Power Supply

As shown in the exploded-view assembly diagram

(page 27), the power supply is mounted to the bottom of the

Enhanced Audio Enclosure's case. This switching-type

power supply converts ac line power (nominal 115 Vac or

230 Vac, 50/60 Hz) to well-regulated 12 Vdc power for use

by the Audio System Board and the Speaker Assemblies

attached to the Enhanced Audio Enclosure. Other than fuse

replacement, the supply is not classified as a field-service-

able unit.

The ac on/off power switch is located on the Enhanced

Audio Enclosure's rear panel just above the detachable

IEC-320 type ac power cord connector. As viewed from the

back of the case, this switch and connector are located on

the left-hand side of the Enhanced Audio Enclosure's rear

panel.

A two-wire power cable between the power supply and

the I/O Backplane Board delivers twelve-volt dc (12 Vdc)

power to the I/O Backplane Board. The I/O Backplane

Board distributes this power to the Audio System Board via

the 96-pin DIN connectors and to its four (4) DB-9 speaker

connectors at the Enhanced Audio Enclosure's rear panel.

Consequently, the power supply unit within the Enhanced

Audio Enclosure supplies dc operating power to all Speaker

Assemblies connected to the Enhanced Audio Enclosure. As

described later in this manual and in the speaker assemblies

manual included with this manual set, this dc power is util-

ized by the audio power amplification circuitry within each

connected Speaker Assembly.

I/O Backplane Board

Inside the Enhanced Audio Enclosure, the I/O

Backplane Board is vertically-mounted on the enclosure's

rear panel. This board is the junction point for all audio

interconnections into and out of the Enhanced Audio

Enclosure to and from external audio devices. Microphones,

headsets, speakers, CEC/IMC audio lines, etc., all terminate

at the I/O Backplane Board. In addition other

interconnections made at the I/O Backplane Board include

control-type connections such as the PC's serial control data

link, the dispatch keyboard serial link and, optionally,

interconnections to Call Director telephone equipment.

The I/O Backplane Board consists of twenty-one (21)

connectors, nineteen (19) of which extend through Enhanced

Audio Enclosure's rear panel for external device connec-

1 2 ... 17 18 19 20 21 22 23 24 25 26 27 28 29 30

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